Microchip Manufacturer D1C & D1D

Process, Semiconductor

Hillsboro, Oregon

General Contractor: Hoffman & Skanska
Contract Value: $38M
Year Completed: 2003
Scope of Work: Process
Services: Design, Detailing, Fab
Delivery: Plan & Spec

Project Description:  Confidential

A collaborative effort delivered this 300-mm wafer fabrication plant in record time. Just 12 months transpired between first concrete and achieving operational ready status for this plan consisting of 150,000 SF of Class 1 and 10 cleanroom, as well as associated office and support space. D1D-Process (Wafer, node) 300 mm, 14 nm.