Microchip Manufacturing MOD 2

All Projects, BIM, Lump Sum, Manufacturing, Semi 3 Project Cat, Semiconductor

Hillsboro, Oregon

General Contractor: Hoffman
Contract Value: $16.5M
Year Completed: 2014
Scope of Work: Plumbing, Process, Lab
Services: Detailing, Fab, Install
Delivery: Plan & Spec, Lump Sum

 

Project Description: Most advanced research and development fabrication facility featuring 200,000 square feet of cleanroom space. It is where the development of its next generation chip technology will be manufactured that won’t likely hit the market until late 2015. This project will serve the same research and development function of its MOD1. MOD2 simply adds additional capacity to that work.

Murray Company’s scope of work performed was the Oil Free Air (OFA), High Purity Oil Free Air (HPOFA) and Super High Purity Oil Free Air (SHPOFA).

We met every milestone on the project and received numerous letters of commendation from both the General Contractor and the Owner for schedule and performance. We also received 3 crews-of-the-week awards for productivity and quality of work. Project consisted of 111,000 man-hours with zero recordable injuries and zero lost-time injuries.